Samsung Electronics Announces Plans to Invest in 1.4nm Process Technology and Production Capacity at 2022 Samsung Foundry Forum

• Samsung targets volume production of 2nm process technology by 2025 and 1.4nm process technology by 2027.
• Samsung plans to more than triple its advanced node capacity by 2027.
• Non-mobile applications, including HPC and automotive, are expected to account for over 50% of the foundry portfolio by 2027
• Samsung Foundry is enhancing its customer service capabilities across its partner ecosystem.

Samsung Electronics, a global leader in advanced semiconductor technology, today announced that it will introduce cutting-edge technology to enhance its foundry business’ business strategy at the annual Samsung Foundry Forum event.

With significant market growth in high-performance computing (HPC), artificial intelligence (AI), 5/6G connectivity, and automotive applications, the demand for advanced semiconductors is increasing dramatically, driving foundry customers’ business growth. Innovation in semiconductor process technology has become essential for success. To that end, Samsung has emphasized its commitment to introduce its 1.4 nanometer (nm) state-of-the-art process technology for mass production in 2027.

During the event, Samsung also outlined the steps its foundry business is taking to meet customer needs. This includes △ foundry process technology innovation, △ process technology optimization for each specific application, △ stable production capacity and △ customized service for customers.

“Technology development targets down to 1.4nm, application-specific foundry platforms, and stable supply with consistent investment are all part of Samsung’s strategy to ensure customer trust and support their success.” Foundry business manager of Samsung Electronics. “Enabling innovation for every customer together with our partners is at the core of our foundry services.”

Introducing Samsung’s Advanced Node Roadmap to 1.4nm in 2027

With the company’s success in introducing its latest 3nm process technology into mass production, Samsung will further strengthen its gate-all-around (GAA)-based technology, targeting a 2nm process in 2025 and a 1.4nm process in 2027. We plan to introduce it.

As a pioneer in process technology, Samsung is also accelerating the development of 2.5D/3D heterogeneous integrated packaging technology to provide total system solutions with foundry services.

Through continuous innovation, 3D packaging X-Cubes with microbump interconnects will be ready for mass production in 2024, and bumpless X-Cubes will be available in 2026.

HPC, automotive and 5G share will be over 50% by 2027

Samsung plans to aggressively target high-performance, low-power semiconductor markets such as HPC, automotive, 5G, and Internet of Things (IoT).

To better meet customer needs, this year’s Foundry Forum introduced a customized and tailored process node. Samsung will strengthen its GAA-based his 3nm process support for HPC and mobile, while further diversifying his 4nm process dedicated to HPC and automotive applications.

Specifically for automotive customers, Samsung now offers embedded non-volatile memory (eNVM) solutions based on 28nm technology. To support automotive-grade reliability, the company plans to launch his 14nm eNVM solution in 2024 and further expand its process nodes by adding his 8nm eNVM in the future. Following his 14nm RF, Samsung is mass producing his 8nm RF and is currently developing a 5nm RF.

“Shell First” operation strategy to respond to customer needs in a timely manner

By 2027, Samsung plans to expand its advanced node capacity by more than three times compared to this year.

Including a new fab under construction in Taylor, Texas, Samsung’s foundry manufacturing lines are now located in five locations in South Korea: Giheung, Hwaseong and Pyeongtaek. Austin and Taylor in the United States.

At the event, Samsung detailed its “shell first” strategy for capacity investment, building clean rooms first, regardless of market conditions. With cleanrooms readily available, manufacturing equipment can be installed later for flexible set-up to meet future demands. Through a new investment strategy, Samsung will be better able to meet customer demands.

Also introduced were plans to invest in Taylor’s new “Shell First” manufacturing line, following the first line announced last year, and potential expansion of Samsung’s global semiconductor production network.

Expanding the SAFE ecosystem to power customized services

Following the “Samsung Foundry Forum”, Samsung will host the “SAFE Forum” (Samsung Advanced Foundry Ecosystem) on October 4th. Introducing new foundry technologies and strategies with ecosystem partners, covering areas such as Electronic Design Automation (EDA), IP, Outsourced Semiconductor Assembly and Test (OSAT), Design Solution Partners (DSP) and Cloud.

In addition to 70 partner presentations, the Samsung Design Platform team leader will showcase the possibilities of applying Samsung’s processes, such as design technology co-optimization for GAA and 2.5D/3DIC.

As of 2022, Samsung offers over 4,000 IPs with 56 partners, working with 9 and 22 partners on design solutions and EDA respectively. We also offer cloud services from 9 partners and packaged services from 10 partners.

Together with our ecosystem partners, Samsung provides integrated services that support solutions from IC design to 2.5D/3D packaging.

Through its robust SAFE ecosystem, Samsung will actively attract new customers, such as hyperscalers and start-ups, while enhancing its customized services with improved performance, fast delivery, and competitive prices. We plan to identify new fabless customers.

The ‘Samsung Foundry Forum’ will be held in the US (San Jose) on October 3, Europe (Munich, Germany) on the 7th, Japan (Tokyo) on the 18th, and South Korea (Seoul) on the 20th. Customized solutions are introduced for each region. A recording of the event will be available online from He on the 21st for those who were unable to attend in person.